HOKOSHA Co.Ltd

Area

Special Themed Area

Booth Location

S002

Exhibitor Information

Exhibit three-dimensional circuit pattern
technology [molecular bonding technology] and
[3-dimensional circuit pattern technology] .
Introduction of "new substrate-less" proposal
for heat dissipation using MARBS (three-dimensional
circuit pattern technology) .

LED illumination for high quality inspection
using high heat dissipation by molecular bonding
technology　
· Realize high brightness and high heat dissipation
　LED illumination using curved wiring technology .
· Realize significant improvement in inspection
　accuracy of conventional visual inspection
　equipment.