Sankyo Kasei Co.,Ltd.
- Area
- Total Solutions
- hall
- hall3
- Booth Location
- C018
- Products
Sensor
Coupling parts
High-frequency components
Electronic circuits
Molded Interconnect Device (MID)
Exhibitor Information
Molded Interconnect Device (MID) is a molded circuit component in which an electric circuit, an electrode, and a pattern are formed on an injection molded product.
A decade has passed since the MID was proposed by the MIDIA (MID International Association in 1995).
Prior to that, MID was already industrially produced domestically under the names of three-dimensional circuit components and three-dimensional molded circuits.
In 1988, we started mass production of the first MID parts in Japan for automotive sensor parts using our own MID manufacturing method SKW-1.
SKW-MID can freely form circuit patterns, electrodes and shields throughout the resin structure.
MID, which forms electrical circuits on resin structures using only plating and deposition techniques, has attracted attention as an ECO-compatible technology.
With SKW-MID, we propose the creation of new products that are environmentally friendly.
