Fine Feature Electrodeposition Research Laboratory

Area

Special Themed Area

Booth Location

S002

Exhibitor Information

Development of Low　CTE　copper plating solution and 500x500mm coreless PCB Cu plating tool(Tosetz), vapor deposition polymerization tool for liner dielectic film(Ulvac) to solve problem(warpage, crack) caused by heat stress on manufacturing processes for next generation electronic devices applying 3D-IC with TSV, coreless PCB, FO-WLP, glass interposer.

Contact Information

Address

〒5941157　 Osaka Research Institute of Industrial Science and Technology #F306, 2-7-1, Ayumino, Izumi-city, Osaka

URL

https://lowcte.jimdo.com/

Person Job Title

Business Development Department

Person in charge

Yuichiro Torinari

TEL

0725-51-2693

Email 1

y.torinari@gmail.com

Email 2

kkondo828@gmail.com

PR Contact Information

Person Job Title

Business Development Department

Person in charge

Yuichiro Torinari

TEL

090-1204-2233

Email 1

y.torinari@gmail.com

Email 2

kkondo828@gmail.com

Links

URL 1

https://lowcte.jimdo.com/

Fine Feature Electrodeposition Research Laboratory Website