Exhibit Information
| Stage | Key Technologies Stage |
|---|---|
| Hall | hall5 |
| Booth Location | 5K97 |
| Exhibit Products Name |
Software design solutions Ceramic materials |
About "Cross-edge" microprocessing
"Cross-edge" microprocessing technology means combined technologies crossing more than two different leading-edge processing technologies to make a product. The technology is based on the following five processing technologies: Cutting, Grinding, Polishing, Metalizing, and Bonding. Through the "Cross-edge" microprocessing technology, we can provide the four advantages below by undertaking several processes as a one-stop solution partner.
Mounting materials/magnetic materials
High pressure seamless microchannels
We succeeded in the development of the most reliable high pressure-resistance microchannel product by our original manufacturing method which forms microchannels in the single solid metal. The inside channels are completely coated by Au coating, leading to the improvement of corrosion-resistance. Thus, it can be used as an efficient thermal conductor with liquid/gas circulating inside. Also, it can be used a mixing device or analytical device in the biotechnology/medical industries by taking advantage of the high-pressure resistance.
Other materials
Through glass via (TGV)
3-dimensional wafer-level-packaging (WLP) is the most suitable for miniaturizing semiconductor devices. It also can improve the high-frequency properties of the devices with the metal via.
Due to glass properties, microfluidic glass products are superior to PDMS resin ones in terms of thermal and chemical resistance.
About"Cross-edge"microprocessing
