Exhibit Information
| Stage | Key Technologies Stage |
|---|---|
| Hall | hall5 |
| Booth Location | 5K96 |
| Exhibit Products Name |
Passive components (resistors, capacitors, transformers, inductors, OSCs, crystal oscillators, filters) High-frequency modules (digital tuners, RF modules) Ceramic materials Car electronics |
The company has 47 years of experiences and is the all-round metal process provider to various customers.
We focus on in-house process, including metal etching, PI etching, plating, Wire-EDM, CO2/fiber laser, form-machining and drilling work, and the LTCC.
Focusing on foundry service of RF substrates, since 10 years ago, we have been engaged in the development of high-Q/high-density substrates.
Recently, we have developed new dielectric material together with the new concept of co-firing, in collaboration(*) with 7 other institutions, and achieved the world's lowest 0.45 dB/cm of micro-stripline loss at milli-meter wave band. In comparison, previous LTCC substrates exhibits a big loss of 5-6 dB/cm.
The advantages of the HIRAI LTCC is its in-house capability of the metal-clad and the plating of LTCC substrates, and such our technology competance should bring you the effective freedom for optimum design, at lower cost, with the shortest T.A.T..
Ceramic materials
World first milli-meter wave, multi-layer LTCC using high-Q dielectric material
In order to get high Q LTCC substrates, non-glass ceramics has been developed based on a new firing concept and by utilizing the firing simulation soft as well, with 7 institutions (YASUFUKU CERAMICS, MARUSU GRAZE, Meijo University, Nagoya Inst. of Technology, Tokyo Inst. of Technology, JFCC and AIST), in Support Project hosted by Ministry of Economy, Trade and Industry in fiscal year 2011.
As the world's lowest micro-stripline loss at mm-wave was achieved, we have started to provide evaluation samples for provisional customers.
Our new technology enables the multi-layer integration of small mm-wave antenna, tranceiver module and baseband or logic circuitries, that was impossible with previous LTCC substrates due to too much loss at mm-wave, and thereby we could create new LTCC market for the emerging mm-wave applications.
Wireless communication technology and products (Bluetooth , ZigBee, NFC, TransferJet, Others), Wireless LAN technologies & products
MM-wave LTCC antenna with low-loss & low permittivity achieved w. hollow config.
The LTCC substrates that are currently used by HIRAI exhibits paramountly superb characteristics up to approx. 30GHz, developed for the super-computers.
However, as the dielectric loss increases with the frequncy, we devised the quasi-3D, "hollow configuration" for mm-wave antenna together with the post-wall waveguide in order to reduce the loss and permittivity.
The Milli-meter wave slot-array antenna was developed based on the idea, designs, instructions of Associate Professor J.Hirokawa, Tokyo Institute of Technology.
High-frequency modules (digital tuners, RF modules)
Micro-/mm- wave LTCC package
The quasi-3D or 2.5D configuration is a key of LTCC substrates, and we have devoted ourselves in the improvement of the Q factor, dimensional accuracy and the thinner layers, as well.
We provide hermetically sealed packages with multiple cavities and and metal-clad. Embedded passive elements help the miniaturization, decrease of number of components and simplification of assembly, and, hence, result in cost reduction and achieve "reasonable devices".
RF simulaters and measuring equipments are in our office, and we provide RF tests and design supports for your RF/micro-wave/mm-wave substrates.
HIRAI LTCC in the web page(downloadable materials at the bottom left of the page)
